人物經曆
學習經曆
2002.09-2007.06斯坦福大學材料科學與工程系博士
2002.09-2006.01斯坦福大學電氣工程系碩士
1998.09-2002.07清華大學材料科學與工程系學士
工作經曆
2012.10至今清華大學材料學院教學實驗室主任
2010.12至今清華大學材料學院副研究員
2009.03-2010.12清華大學材料科學與工程系講師
2007.04-2009.02美國應用材料公司工藝工程師
主要成就
科研項目：
主持北京市自然科學基金面上項目，2013-2015
主持國家自然科學基金青年基金，2012-2014
主持教育部回國留學人員啟動基金，2012-2013
主持清華信息科學與技術國家實驗室（籌）學科交叉基金，2012-2013
參與國家科技重大專項02，高密度三維系統級封裝，2009-2012
主持“清華-大金”研究中心國際合作項目，熱界面材料和焊接材料，2009-2015
主持清華大學自主科研青年基金2010-2012
主持新型陶瓷與精細工藝國家重點實驗室開放課題，2010-2011
主持清華大學骨幹人才支持計劃
BOOK CHAPTER:
D. Lee*, L. Li and S. X. Wang, “Embedded Inductors”, Materials for Advanced Packaging, Daniel Lu and CP Wong, Eds., Berlin, Germany: Springer, 459-480, 2009.
專利：
盧年端，李亮亮，蔡堅，李燕秋，Co-P薄膜的制備方法，專利号ZL201110092400.6，授權
李亮亮，盧年端，蔡堅，含Co基薄膜的凸點底部金屬層與無鉛焊點連接的方法，專利号ZL201110129670.X，授權
李亮亮，周陽，一種Seebeck系數測試裝置，ZL201210473642.4，授權
PAPERS:
2015
1.W. Li, T. Wu, R. Jiao, B.-P. Zhang, S. Li, Y. Zhou, L. Li*, Effects of silver nanoparticles on the firing behavior of silver paste on crystalline silicon solar cells, Colloids and Surfaces A, vol. 466, 132-137, 2015.
2.D. Yang, J. Cai, Q. Wang, J. Li, Y. Hu and L. Li*, IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling, J Mater Sci: Mater Electron, DOI 10.1007/s10854-014-2489-7 .
3.Y. Lei, C. Zhen and L. Li*, Microwave properties of ferromagnetic nanowire arrays patterned with periodic and quasi-periodic structures, Journal of Applied Physics, accepted.
4.Y. Zhou, Q. Tan, J. Zhu, S. Li, C. Liu, Y. Lei and L. Li*, Thermoelectric properties of amorphous Zr？Ni？Sn thin films deposited by magnetron sputtering, Journal of Electronic Materials, accepted.
2014
1.Y. Zhou, L. Li*, Q. Tan and J.-F. Li, Thermoelectric properties of Pb-doped bismuth telluride thin films deposited by magnetron sputtering, Journal of Alloys and Compounds, vol. 590, 362-367, 2014.
2.Y. Zhou, D. Yang, L. Li*, F. Li and J.-F. Li, Fast Seebeck coefficient measurement based on dynamic method, Review of Scientific Instrument, vol. 85, 054904, 2014.
3.R. Zhang, J. Cai, Q. Wang, J. Li, Y. Hu, H. Du and L. Li*, Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications, Journal of Electronic Packaging, vol. 136, 011012, 2014.
4.D. Yang, G. Yang, J. Cai, Q. Wang, Y. Hu, J. Li, and L. Li*, Reliability of Sn–Pb solder joints with Cu and Co–P surface finishes under thermal cycling, 2014 15th International Conference on Electronic Packaging Technology, 239-243, Aug., 2014.
5.Y. Wang, R. Zhang, J. Li, L. Li, and S. Lin*, First-principles study on transition metal-doped anatase TiO2, Nano research letters, vol. 9, 46, 2014.
2013
1.N. Lu, D. Yang and L. Li*, Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures, Acta Materialia, vol. 61, no. 12, 4581-4590, July, 2013.
2.Y. Yang, L. Li* and W. Li, Plasmon absorption of Au-in-CoAl2O4 linear nanopeapod chains, Journal of Physical Chemistry C, vol. 117, no. 27, 14142–14148, 2013.
3.D. Yang, N. Lu and L. Li*, Wettability of Sn-Bi and Sn-Ag-Cu Lead-Free Solder Pastes on Electroplated Co-P Films, 63rd IEEE Electronic Components and Technology Conference, May, 1686-1691, 2013.
2012
1.H. Yu, L. Li*, T. Kido, G. Xi, G. Xu and F. Guo, Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material, Journal of Applied Polymer Science, vol. 124, no. 1, 669-677, April 2012.
2.H. Yu, L. Li*, Y. Zhang, Silver-nanoparticle based thermal interface materials with ultra-low thermal resistance for power electronics applications, Scripta Materialia, vol. 66, no. 1, 931-934, 2012.
3.N. Lu, J, Cai and L. Li*, Dependence of interfacial adhesion of Co-P film on its microstructure, Surface and Coatings Technology, vol. 206, 4822-4827, 2012.
4.Y. Li and L. Li*, Synthesis and magnetic anisotropy analysis of Co/Au multilayered nanowires, IEEE. Transactions on Magnetics, vol. 48, no.11, 3925-3928, 2012.
5.Y. Li, L. Li* and J. Cai, Dual-band noise suppressors based on Co/Au multilayered magnetic nanowires, IEEE. Transactions on Magnetics, vol. 48, no.11, 4398-4401, 2012.
6.D. Li, L. Li*, D.-W. Liu and J.-F. Li, Temperature dependence of the Raman spectra of Bi2Te3 and Bi0.5Sb1.5Te3 thermoelectric films, Physica Status Solidi Rapid Research Letters, vol. 6, no. 6, 268-270, 2012.
7.G. Zhou and L. Li*, Phonon thermal conductivity of GaN nanotubes, Journal of Applied Physics, vol. 112, 014317, 2012.
8.H. Yu, R. Zhang, L. Li*, X. Mao, H. Du, Silver-based Thermal Interface Materials with Low Thermal Resistance, 2012 International Conference on Electronic Packaging Technology and High Density Packaging, 410-413, Aug., 2012.
9.Z. Chen, Y. Li and L. Li*, Integrated microwave noise suppressor fabricated on magnetic/dielectric composite ceramic substrate, IMAPS/Acers 8th International CICMT conference and Exhibition (2012), April 16-19, 2012, Erfurt, Germany, 000208-000215.
2011
1.N. Lu, Y. Li, J. Cai and L. Li*, Synthesis and characterization of ultrasonic-assisted electroplated Co-P films with amorphous and nanocrystalline structures, IEEE Transactions on Magnetics, vol. 47, no. 10, 3799-3802, Oct., 2011.
2.H. Yu, L. Li* and L. Qi, Viscosity and thermal conductivity of alumina microball/epoxy composites, 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 387-390, Aug., 2011.
3.Y. Zhang, H. Yu and L. Li*, Synthesis and low-temperature sintering of tin-doped silver nanoparticles, 2011 International Symposium on Advanced Packaging Materials, 209-212, Oct., 2011.
4.Y. Li, Z. Chen, L. Li* and J. Cai, 20 gigahertz noise suppressor based on ferromagnetic nanowire arrays, 2011 International Symposium on Advanced Packaging Materials, 94-98, Oct., 2011.
2010
1.D.-W Liu, J.-F. Li*, C. Chen, B.-P. Zhang and L. Li, Fabrication and evaluation of microscale thermoelectric modules of Bi2Te3-based alloys, Journal of Micromechanics and Microengineering, vol. 20, no. 12, 125031-1-6, Nov., 2010.
2.B. Wang and L. Li*, Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 582-586, Aug., 2010.
3.Y. Li, L. Li* and J. Cai, Multi-pulse electrodeposition of soft magnetic thin film Co-P for embedded inductor application, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 220-224, Aug., 2010.
4.H. Yu, L. Li*, T. Kido and G. Xi, Dielectric composite material with enhanced thermal conductivity used for electronic packaging, 2010 International Conference on Electronic Packaging Technology and High Density Packaging, 258-262, Aug., 2010.
2009
1.L. Li*, D. W. Lee, K. Hwang, Y. Min, T, Hizume, M. Tanaka, M. Mao, T. Schnieder, R. Bubber and S. X, Wang, Small-resistance and high-quality-factor magnetic integrated inductors on PCB, IEEE Transactions on Advanced Packaging, vol. 32, no. 4, 780-787, Nov., 2009.
2.L. Li*, D. W. Lee, K. Hwang, Y. Min and S. X. Wang, On-package magnetic materials for embedded inductor applications, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, 471-474, Aug., 2009. (Best paper award)
2007
1.L. Li*, D. W. Lee, M. Mao, T. Schnieder, R. Bubber, K. Hwang, Y. Min, and S. X. Wang, High-frequency responses of granular CoFeHfO and amorphous CoZrTa magnetic materials, Journal of Applied Physics, vol. 101, no. 12, 123912-1-4, June, 2007. (SCI=2.2)11
2.L. Li*, D. W. Lee, S. X. Wang, K. Hwang, Y. Min, M. Mao, T. Schnieder and R. Bubber, Tensor nature of permeability and its effects in inductive magnetic devices, IEEE Transactions on Magnetics, vol. 43, no. 6, 2373-2375, June, 2007.
2006
L. Li*, S. X. Wang, K. Hwang, Y. Min, M. Mao, T. Schnieder and R. Bubber, Package-compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering, Journal of Applied Physics, vol. 99, no. 8, 08M301-1-3, April, 2006.
2005
L. Li*, A. M. Crawford, S. X. Wang, A. F, Marshall, M. Mao, T. Schnieder and R. Bubber, Soft magnetic granular material Co-Fe-Hf-O for micromagnetic device applications, Journal of Applied Physics, vol. 97, no. 10, 10F907-1-3, May, 2005.
2001
L. Li, Y. An* and C. Ying, Experimental parameters and the stability of sonoluminescing bubbles, Chinese Physics Letters, vol. 18, no.11, 1523-1526, Nov., 2001.
社會任職
IEEE會員
中國電子學會高級會員
